Open
| Close
| High
| Low
| Previous Close
| Daily Price Gain
|
YTD High
| YTD High Date
| YTD Low
| YTD Low Date
| YTD Price Change
| YTD Gain
|
52 Week High
| 52 Week High Date
| 52 Week Low
| 52 Week Low Date
| 52 Week Price Change
| 52 Week Gain
|
These are sample algorithmic trades based on actual market data.
Stock Symbol
| Exchange
| Company URL
| Company Phone
|
CEO
| Headquarters
| Business Address
| |
Sector
| Industry Category
| Industry Group
| CIK
|
About
Kulicke & Soffa Industries, Inc. provides semiconductor packaging and electronic assembly solutions for the automotive, consumer, communications, computing and industrial segments. It operates through the following segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, heavy wire wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment produces and sells a variety of tools for a broad range of semiconductor packaging applications including capillaries, bonding wedges and saw blades. The company was founded by Frederick W. Kulicke and Albert Soffa in 1951 and is headquartered in Singapore. | |||
Description
Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices. It operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold, silver alloy, or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; wafer level bonders, which mechanically applies bumps to dies for some variants of the flip chip assembly process; and wedge bonders to connect semiconductor chips for the power packages, power hybrids, and automotive modules. This segment also provides advanced packaging with adaptive machine analytics chip-to-substrate bonders for flip chip and thermo-compression bonding applications; and electronic assembly solutions, as well as spare parts, equipment repair, maintenance and servicing, equipment upgrading, and training services. The Expendable Tools segment offers various expendable tools for a range of semiconductor packaging applications. This segment's products include capillaries for use in ball bonders, as well as gold wire bonding; bonding wedges for use in heavy wire wedge bonders; dicing blades that are used for cutting silicon wafers into individual semiconductor dies. The company serves semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore. |