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About
ChipMOS Technologies, Inc. engages in the provision of semiconductor testing and packaging solutions. Its products include testing services, assembly services, gold bumping services, enabling technology, and eService. The company was founded on July 28, 1997 and is headquartered in Hsinchu, Taiwan. | |||
Description
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision IC products. The company provides a range of back-end testing and assembly services for semiconductor memory and mixed-signal products; and technical and assembly services for liquid crystal display driver IC products. It also offers various technologies, including lead frames and organic substrate carriers for the use in personal computers, networks/communications, office automation, and consumer electronics. In addition, the company engages in wafer bumping services; and manufacturing of memory modules. It serves semiconductor design houses, integrating device manufacturers, and semiconductor fabs in Taiwan, Singapore, the United States, Japan, Korea, Hong Kong, and other countries. The company was founded in 1997 and is based in Hsinchu, Taiwan. |